Solder resist or mask is applied to the surface to protect it from atmospheric contamination, conductor shorts and mechanical damage. Solder resist ink, which is photo sensitive, is applied to the entire area of the panel. It is then dried and exposed with photo tools in a precision glass to glass printing frame.
The exposed panel is then developed, to clear the pads, and then baked to cure the solder mask. The component pads are required to be left clear for subsequent solder processing. We are capable of applying different types of wet solder resist in a variety of colours.