Bonded panels are milled to a precise size with rounded panel corners that will minimise the risk of panel damage during the remainder of the processing operation.
Bonded multilayer panels are checked on real time X-ray for inner layer alignment and to also locate the exact position of the inner layer's. This information is used to align the drilling machine with the panel to ensure that the drilled holes are centralised to the inner layer pads.
The panels are then placed between pieces of sacrificial entry and exit material and the packagetooling holes are drilled. These holes are then re-checked for alignment upon the X-ray machine prior to drilling the circuit via holes.
We are capable of producing many types of holes from micro vias to slots and have the capacity to drill 2.8 million holes per day.
Two layer panels, conventional PTH, join the process at this stage. From here on, both multilayer panels and two layer PTH panels follow the same production route.
