Hot Air Solder Level (HASL) - Thickness 4 to 40 µm
Immersion Tin - Thickness 1 to 1.2 µm
Immersion Gold over Nickel - Thickness 0.08 to 0.12µm Gold Over 3 to 5µm Nickel
For a number of years, fabricators and assemblers have been looking for a finish which combines excellent solderability, flatness and lead free soldering at a cost effective price.
CC Electronics have evaluated and supplied a number of alternative finishes to HASL including Immersion nickel gold, OSP and immersion silver. We have however identified one finish which is superior in terms of quality, price and versatility. Twin stage immersion tin differs from traditional tin finishes, because it uses a unique fine grain tin between the copper and the solderable surface to prevent intermetallic growth (which can lead to poor solderabilty).
It provides a perfectly flat surface ideal for surface mount and BGA and is the perfect finish for high aspect ratio press fit backplanes due to its even deposit and the low insertion force required to load components. It is a far more stable process than immersion nickel gold and is easier and cheaper to produce. We have total confidence in this product, having made thousand of circuits over the last few years, and can recommend it strongly for use on all fine pitch surface mount, BGA and press fit pcb's.
In summary the benefits of our "Atotech" twin stage Immersion Tin finish are as follows:
The Atotech Immersion Tin Finish has been approved by a number of the worlds largest OEM's including; - Lucent, Marconi, Philips, Alcatel, Cisco, Telital and Siemens.
