| Material | Tg | Dk at 1 Mhz | DK at 1 Ghz | Dk at 10 Ghz | Dispn Factor at 1 Mhz | Dispn Factor at 1 Ghz | Dispn Factor 10 Ghz | CTE X ppm/°C | CTE Y ppm/°C | CTE Z |
|---|---|---|---|---|---|---|---|---|---|---|
| FR4 | 140 °C | 4.4 | 3.9 | - | 0.027 | 0.015 | - | 12-16 ppm | 12-16 ppm | 4.50% |
| High Tg Fr4 | 180 °C | 4.4 | 3.9 | - | 0.023 | 0.012 | - | 10-14 ppm | 10-14 ppm | 3.70% |
| Resin Coated Copper Foil | 170 °C | 3.6 | 3.4 | 3.3 | 0.02 | 0.02 | 0.02 | 125 ppm | 125 ppm | 125 ppm |
| Polyimide | > 250 °C | 4.2 | - | - | 0.012 | - | - | 16-17 ppm | 16-17 ppm | 55 ppm/°C |
| Rogers 4350 | > 280 °C | - | - | 3.48 | - | - | 0.004 | 14 ppm | 16 ppm | 50 ppm/°C |
TG = Glass transition point. The point at which the laminate softens.
Dispn Factor = The Dissipation Factor or Loss Tangent of the material.
CTE X,Y,Z = Coefficient of thermal expansion in each of the three physical axes.
DK = Dielectric Constant
| STD FR4 |
|---|
| 0.1,0.125,0.2,0.25,0.3,0.35,0.4,0.5,0.6,0.711,0.76,0.88,0.910,1.00,1.08,1.57 |
| Copper Weights |
|---|
| 0.25oz, thickness 9 micron* |
| 0.33oz, thickness 12 micron* |
| 0.5oz, thickness 17.5 micron |
| 1.0oz, thickness 35 micron |
| 2.0oz, thickness 70 micron* |
| 3.0oz thickness 105 micron* |
* May require longer lead times due to material availability
| FR4 Prepreg style and thickness |
|---|
| 1080, thickness 0.06mm |
| 2125, thickness 0.09mm |
| 7628, thickness 0.18mm |
| Also available but not stocked 2113, thickness 0.1mm |
