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Pressfit Backplanes
Part of our product portfolio is the ability to manufacture pressfit backplanes, ranging from traditional VME to Compact PCI architecture.
Using the latest pulse plating technology the amount of plating within the holes is controlled to achieve a finished hole tolerance of + / - 0.05 mm.
Our Immersion Tin finish was selected to meet the requirements for low insertion forces for pressfit connectors, in addition to a flat solderable finish, for those designs that include BGA's and other fine pitch surface mount devices.
Our experience in manufacturing backplanes has extended the boundaries of our capability, giving us the ability to plate a full thickness copper deposit throughout the barrel of the hole, for designs demanding an aspect ratio of up to 10.6.
